Direct bonded heterogeneous integration packaging structures

US11177217B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Kamal K. Sikka · Poughkeepsie, US
• Jon A. Casey · Poughkeepsie, US
• Joshua M. Rubin · Albany, US
• Arvind Kumar · Beaverton, US
• Dinesh Gupta · Hopewell Junction, US
• Charles L. Arvin · Savannah, US
• Mark W. Kapfhammer · Fishkill, US
• Steve Ostrander · Poughkeepsie, US
• Maryse Cournoyer · Keyano, CA
• Valerie Oberson · Granby, CA
• Lawrence A. Clevenger · Saratoga Springs, US

Key dates

• Filing date: Jan 9, 2020
• Grant date: Nov 16, 2021
• Expiry date: Jan 9, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/16152
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.