Through-wafer interconnects for photoimager and memory wafers

US7683458B2 · kind B2 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Salman Akram · Boise, US
• Charles M. Watkins · Eagle, US
• William M. Hiatt · Eagle, US
• David R. Hembree · Boise, US
• James M. Wark · Boise, US
• Warren M. Farnworth · Nampa, US
• Mark E. Tuttle · Boise, US
• Sidney B. Rigg · Meridian, US
• Steven Oliver · Boise, US
• Kyle K. Kirby · Eagle, US
• Alan G. Wood · Boise, US
• Lu Velicky · Boise, US

Key dates

• Filing date: Oct 26, 2007
• Grant date: Mar 23, 2010
• Expiry date: Nov 6, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/811
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.