Through-wafer interconnects for photoimager and memory wafers

US8502353B2 · kind B2 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Salman Akram · Boise, US
• Charles M. Watkins · Eagle, US
• William M. Hiatt · Eagle, US
• David R. Hembree · Boise, US
• James M. Wark · Boise, US
• Warren M. Farnworth · Nampa, US
• Mark E. Tuttle · Boise, US
• Sidney B. Rigg · Meridian, US
• Steven Oliver · Boise, US
• Kyle K. Kirby · Eagle, US
• Alan G. Wood · Boise, US
• Lu Velicky · Boise, US

Key dates

• Filing date: Jun 7, 2011
• Grant date: Aug 6, 2013
• Expiry date: Jun 7, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/811
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.