Charles Steven Korman
32Patents
19h-index
48Co-inventors
81Inventor score
Filing activity: Apr 27, 1988 → May 24, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5532512A | Direct stacked and flip chip power semiconductor device structures | Electricity | 214 | Expired |
| US5111253A | Multicellular FET having a Schottky diode merged therewith | Electricity | 202 | Expired |
| US6306680A | Power overlay chip scale packages for discrete power devices | Electricity | 165 | Expired |
| US4903189A | Low noise, high frequency synchronous rectifier | Electricity | 107 | Expired |
| US5119283A | High power factor, voltage-doubler rectifier | Emerging Cross-Sectional Technologies | 100 | Expired |
| US5959357A | Fet array for operation at different power levels | Electricity | 94 | Expired |
| US6377461B1 | Power electronic module packaging | Electricity | 85 | Expired |
| US5384691A | High density interconnect multi-chip modules including embedded distributed power supply elements | Electricity | 68 | Expired |
| US5119153A | Small cell low contact resistance rugged power field effect devices and method of fabrication | Emerging Cross-Sectional Technologies | 62 | Expired |
| US7642449B2 | Photovoltaic integrated building component | Emerging Cross-Sectional Technologies | 54 | Active |
| US8595996B2 | Photovoltaic framed module array mount utilizing asymmetric rail | Emerging Cross-Sectional Technologies | 48 | Active |
| US4998151A | Power field effect devices having small cell size and low contact resistance | Electricity | 48 | Expired |
| US6232151A | Power electronic module packaging | Electricity | 46 | Expired |
| US7262444B2 | Power semiconductor packaging method and structure | Electricity | 37 | Expired |
| US5043859A | Half bridge device package, packaged devices and circuits | Electricity | 34 | Expired |
| US4985740A | Power field effect devices having low gate sheet resistance and low ohmic contact resistance | Electricity | 32 | Expired |
| US5609946A | High frequency, high density, low profile, magnetic circuit components | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5745981A | Method for making magnetic and electromagnetic circuit components having embedded magnetic materials in a high density interconnect structure | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5329225A | Thin film superconductor inductor with shield for high frequency resonant circuit | Emerging Cross-Sectional Technologies | 22 | Expired |
| US8455752B2 | Integral ac module grounding system | Emerging Cross-Sectional Technologies | 19 | Active |
| US5234851A | Small cell, low contact assistance rugged power field effect devices and method of fabrication | Electricity | 17 | Expired |
| US6930610B2 | Monitoring system and method for wiring systems | Physics | 13 | Expired |
| US5525941A | Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure | Emerging Cross-Sectional Technologies | 12 | Expired |
| US8922972B2 | Integral module power conditioning system | Emerging Cross-Sectional Technologies | 7 | Active |
| US5812384A | Matrix filters for low-noise power distribution systems | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.