David Kohen
10Patents
2h-index
13Co-inventors
43Inventor score
Filing activity: Dec 29, 2016 → Jan 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10236177B1 | Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures | Electricity | 399 | Active |
| US11031242B2 | Methods for depositing a boron doped silicon germanium film | Chemistry; Metallurgy | 2 | Active |
| US11557474B2 | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation | Electricity | 0 | Active |
| US12040184B2 | Methods for forming a semiconductor structure and related semiconductor structures | Electricity | 0 | Active |
| US10923344B2 | Methods for forming a semiconductor structure and related semiconductor structures | Electricity | 0 | Active |
| US10510536B2 | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber | Electricity | 0 | Active |
| US10535516B2 | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures | Electricity | 0 | Active |
| US11996289B2 | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods | Electricity | 0 | Active |
| US11482533B2 | Apparatus and methods for plug fill deposition in 3-D NAND applications | Electricity | 0 | Active |
| US10141189B2 | Methods for forming semiconductors by diffusion | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.