Eric M. Apelgren
11Patents
5h-index
14Co-inventors
59Inventor score
Filing activity: Nov 26, 1996 → Dec 17, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6261963A | Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6514844B1 | Sidewall treatment for low dielectric constant (low K) materials by ion implantation | Electricity | 13 | Expired |
| US6610594B2 | Locally increasing sidewall density by ion implantation | Electricity | 11 | Expired |
| US6500755B2 | Resist trim process to define small openings in dielectric layers | Electricity | 11 | Expired |
| US5780861A | Adjustable blade reticle assembly | Physics | 6 | Expired |
| US6315637A | Photoresist removal using a polishing tool | Performing Operations; Transporting | 5 | Expired |
| US6406993B1 | Method of defining small openings in dielectric layers | Electricity | 4 | Expired |
| US7737021B1 | Resist trim process to define small openings in dielectric layers | Electricity | 2 | Active |
| US6313538A | Semiconductor device with partial passivation layer | Electricity | 1 | Expired |
| US5848382A | Method for automated energy dose measurement and adjustment for a photoaligner | Physics | 0 | Expired |
| US8003306B2 | Methods of forming electronic devices by ion implanting | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.