Inventor · Hefei, CN

Erxuan PING

10Patents
1h-index
8Co-inventors
36Inventor score

Filing activity: Nov 11, 2020 → Jan 14, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US11895852B2 Method for forming semiconductor structure by using sacrificial layer configured to be replaced subsequently to form bit line, semiconductor structure, and memory Electricity 1 Active
US12108591B2 Semiconductor structure, method for forming semiconductor structure and memory Electricity 1 Active
US12082419B2 Semiconductor structure and forming method therefor, and memory and forming method therefor Electricity 1 Active
US12419041B2 Method for forming storage node contact structure and semiconductor structure Electricity 0 Active
US11887859B2 Method for forming active region array and semiconductor structure Electricity 0 Active
US11805701B2 Memory and forming methods and control methods thereof Electricity 0 Active
US11871562B2 Method for forming storage node contact structure and semiconductor structure Electricity 0 Active
US11875835B2 Memory and read and write methods of memory Physics 0 Active
US12376291B2 Semiconductor device including shared sense amplification circuit group Physics 0 Active
US12340870B2 Method for forming a semiconductor device pillar with source, channel, and drain Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.