Inventor · Beaverton, OR, US

Hiten Kothari

11Patents

3h-index

26Co-inventors

60Inventor score

Filing activity: Jul 2, 2004 → Sep 19, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9449913B2	3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias	Electricity	15	Active
US9142510B2	3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach	Electricity	14	Active
US9721886B2	Preservation of fine pitch redistribution lines	Electricity	4	Active
US11393754B2	Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication	Electricity	2	Active
US9818710B2	Anchored interconnect	Electricity	2	Active
US7361261B2	Method of preparing a chiral substrate surface by electrodeposition	Chemistry; Metallurgy	0	Expired
US11489112B2	Resistive random access memory device and methods of fabrication	Electricity	0	Active
US12406931B2	Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication	Electricity	0	Active
US9530740B2	3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach	Electricity	0	Active
US12261122B2	Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication	Electricity	0	Active
US11430948B2	Resistive random access memory device with switching multi-layer stack and methods of fabrication	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.