Inventor · Fremont, CA, US

Joydeep Guha

18Patents

8h-index

25Co-inventors

64Inventor score

Filing activity: Feb 3, 2012 → Apr 30, 2018

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8784676B2	Waferless auto conditioning	Electricity	263	Active
US9837286B2	Systems and methods for selectively etching tungsten in a downstream reactor	Electricity	103	Active
US9601319B1	Systems and methods for eliminating flourine residue in a substrate processing chamber using a plasma-based process	Electricity	96	Active
US9082826B2	Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor features	Electricity	32	Active
US10622189B2	Adjustable side gas plenum for edge rate control in a downstream reactor	Electricity	27	Active
US8608973B1	Layer-layer etch of non volatile materials using plasma	Electricity	21	Active
US9147581B2	Dual chamber plasma etcher with ion accelerator	Electricity	21	Active
US9972478B2	Method and process of implementing machine learning in complex multivariate wafer processing equipment	Electricity	18	Active
US10615009B2	System implementing machine learning in complex multivariate wafer processing equipment	Electricity	7	Active
US10134605B2	Dual chamber plasma etcher with ion accelerator	Electricity	4	Active
US9018103B2	High aspect ratio etch with combination mask	Electricity	4	Active
US9431269B2	Dual chamber plasma etcher with ion accelerator	Electricity	4	Active
US8895323B2	Method of forming a magnetoresistive random-access memory device	Electricity	2	Active
US9870932B1	Pressure purge etch method for etching complex 3-D structures	Electricity	1	Active
US9514955B2	Patterning of a hard mask material	Electricity	0	Active
US9659783B2	High aspect ratio etch with combination mask	Electricity	0	Active
US10242883B2	High aspect ratio etch of oxide metal oxide metal stack	Electricity	0	Active
US9899227B2	System, method and apparatus for ion milling in a plasma etch chamber	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.