Li-Lin Su
20Patents
4h-index
21Co-inventors
59Inventor score
Filing activity: Aug 3, 2004 → Jul 19, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7704886B2 | Multi-step Cu seed layer formation for improving sidewall coverage | Electricity | 12 | Active |
| US9530737B1 | Semiconductor device and manufacturing method thereof | Electricity | 10 | Active |
| US7253501B2 | High performance metallization cap layer | Electricity | 8 | Expired |
| US9614052B2 | Copper contact plugs with barrier layers | Electricity | 6 | Active |
| US8252690B2 | In situ Cu seed layer formation for improving sidewall coverage | Electricity | 3 | Active |
| US9136206B2 | Copper contact plugs with barrier layers | Electricity | 3 | Active |
| US11088020B2 | Structure and formation method of interconnection structure of semiconductor device | Electricity | 3 | Active |
| US10534273B2 | Multi-metal fill with self-aligned patterning and dielectric with voids | Electricity | 2 | Active |
| US9721894B2 | Semiconductor device and manufacturing method thereof | Electricity | 2 | Active |
| US7453149B2 | Composite barrier layer | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9589897B1 | Trench liner for removing impurities in a non-copper trench | Electricity | 1 | Active |
| US8034709B2 | Method for forming composite barrier layer | Emerging Cross-Sectional Technologies | 0 | Active |
| US12062611B2 | Integrated circuit interconnect structures with air gaps | Electricity | 0 | Active |
| US11244898B2 | Integrated circuit interconnect structures with air gaps | Electricity | 0 | Active |
| US11127680B2 | Semiconductor device and manufacturing method thereof | Electricity | 0 | Active |
| US11860550B2 | Multi-metal fill with self-aligned patterning and dielectric with voids | Electricity | 0 | Active |
| US9935006B2 | Trench liner for removing impurities in a non-copper trench | Electricity | 0 | Active |
| US11251131B2 | Copper contact plugs with barrier layers | Electricity | 0 | Active |
| US11422475B2 | Multi-metal fill with self-aligned patterning and dielectric with voids | Electricity | 0 | Active |
| US10700010B2 | Copper contact plugs with barrier layers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.