Mark Harrison
10Patents
1h-index
14Co-inventors
47Inventor score
Filing activity: Jul 9, 2010 → Apr 4, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8487440B2 | Backside processing of semiconductor devices | Electricity | 2 | Active |
| US9553016B2 | Contacts for semiconductor devices and methods of forming thereof | Electricity | 1 | Active |
| US9006899B2 | Layer stack | Electricity | 0 | Active |
| US11501979B1 | Semiconductor device and method of producing a semiconductor device | Electricity | 0 | Active |
| US8866299B2 | Backside processing of semiconductor devices | Electricity | 0 | Active |
| US11393736B2 | Method of manufacturing a semiconductor device having an integrated pn diode temperature sensor | Electricity | 0 | Active |
| US10115688B2 | Solder metallization stack and methods of formation thereof | Electricity | 0 | Active |
| US9824972B2 | Contacts for semiconductor devices and methods of forming thereof | Electricity | 0 | Active |
| US12300654B2 | Semiconductor device with metal silicide layer | Electricity | 0 | Active |
| US10573611B2 | Solder metallization stack and methods of formation thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.