Michael S. Jackson
20Patents
4h-index
63Co-inventors
66Inventor score
Filing activity: Jul 31, 1998 → Dec 19, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8291857B2 | Apparatuses and methods for atomic layer deposition | Emerging Cross-Sectional Technologies | 355 | Active |
| US6057244A | Method for improved sputter etch processing | Electricity | 27 | Expired |
| US8293015B2 | Apparatuses and methods for atomic layer deposition | Emerging Cross-Sectional Technologies | 20 | Active |
| US7705275B2 | Substrate support having brazed plates and resistance heater | Electricity | 19 | Active |
| US6375753B1 | Method and apparatus for removing processing liquid from a processing liquid delivery line | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8747556B2 | Apparatuses and methods for atomic layer deposition | Emerging Cross-Sectional Technologies | 3 | Active |
| US9275865B2 | Plasma treatment of film for impurity removal | Electricity | 2 | Active |
| US10643840B2 | Selective deposition defects removal by chemical etch | Electricity | 2 | Active |
| US11586160B2 | Reducing substrate surface scratching using machine learning | Physics | 1 | Active |
| US6305392A | Method and apparatus for removing processing liquid from a processing liquid delivery line | Emerging Cross-Sectional Technologies | 1 | Expired |
| US11033930B2 | Methods and apparatus for cryogenic gas stream assisted SAM-based selective deposition | Performing Operations; Transporting | 0 | Active |
| US10770292B2 | Wafer treatment for achieving defect-free self-assembled monolayers | Electricity | 0 | Active |
| USD1071886S1 | Substrate support for a substrate processing chamber | General | 0 | Active |
| US8637410B2 | Method for metal deposition using hydrogen plasma | Electricity | 0 | Active |
| US11735420B2 | Wafer treatment for achieving defect-free self-assembled monolayers | Electricity | 0 | Active |
| US10950433B2 | Methods for enhancing selectivity in SAM-based selective deposition | Electricity | 0 | Active |
| US9017776B2 | Apparatuses and methods for atomic layer deposition | Emerging Cross-Sectional Technologies | 0 | Active |
| US11515155B2 | Methods for enhancing selectivity in SAM-based selective deposition | Electricity | 0 | Active |
| US10593521B2 | Substrate support for plasma etch operations | Electricity | 0 | Active |
| US11835927B2 | Reducing substrate surface scratching using machine learning | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.