Richard E. Bornfreund
13Patents
3h-index
23Co-inventors
56Inventor score
Filing activity: Oct 24, 2006 → Dec 21, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7629582B2 | Dual band imager with visible or SWIR detectors combined with uncooled LWIR detectors | Performing Operations; Transporting | 36 | Active |
| US8471204B2 | Monolithic electro-optical polymer infrared focal plane array | Electricity | 9 | Active |
| US10153204B2 | Wafer level packaging of reduced-height infrared detectors | Emerging Cross-Sectional Technologies | 3 | Active |
| US9029783B2 | Multilayered microbolometer film deposition | Electricity | 3 | Active |
| US8179529B1 | Alignment systems and methods | Physics | 2 | Active |
| US9945729B2 | Systems and methods for enhanced bolometer response | Physics | 1 | Active |
| US8552479B2 | Aluminum indium antimonide focal plane array | Emerging Cross-Sectional Technologies | 1 | Active |
| US8552480B2 | Aluminum indium antimonide focal plane array | Emerging Cross-Sectional Technologies | 1 | Active |
| US8502147B2 | Microbolometer detector layer | Physics | 1 | Active |
| US10971540B2 | Method and systems for coupling semiconductor substrates | Electricity | 1 | Active |
| US10020343B2 | Wafer-level back-end fabrication systems and methods | Electricity | 0 | Active |
| US11916039B2 | Semiconductor device interconnection systems and methods | Electricity | 0 | Active |
| US9822439B2 | Deposition systems and methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.