Toshiyuki Ohta
19Patents
6h-index
32Co-inventors
66Inventor score
Filing activity: Jan 25, 1980 → Aug 7, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4298962A | Memory | Electricity | 137 | Expired |
| US6489389B1 | Rubber composition for tire treads | Chemistry; Metallurgy | 23 | Expired |
| US6113750A | Method of forming thin metal films | Electricity | 20 | Expired |
| US5751607A | Method of sputter deposition simulation by inverse trajectory calculation | Physics | 14 | Expired |
| US5801971A | Form simulation device and its simulating method by the use of the Monte Carlo method | Electricity | 6 | Expired |
| US6226768A | Coded frame synchronizing method and circuit | Electricity | 6 | Expired |
| US5983011A | Method of simulating a profile of sputter deposition which covers a contact hole formed on a semiconductor wafer | Physics | 5 | Expired |
| US6199029A | Topography simulation method and system of plasma-assisted etching process | Physics | 5 | Expired |
| US5765128A | Apparatus for synchronizing a voice coder and a voice decoder of a vector-coding type | Electricity | 5 | Expired |
| US5850356A | Simulation apparatus for optimizing sputtering apparatus and simulation method therefor | Physics | 4 | Expired |
| US5815684A | Configuration simulating method employing string model for simulating layer configuration of silicon wafer | Physics | 4 | Expired |
| US7949535B2 | User authentication system, fraudulent user determination method and computer program product | Physics | 3 | Active |
| US9732494B2 | Bucket and working vehicle provided with the same | Fixed Constructions | 3 | Active |
| US6361406B1 | Abrasion method of semiconductor device | Performing Operations; Transporting | 2 | Expired |
| US9719229B2 | Bucket and working vehicle provided with the same | Fixed Constructions | 2 | Active |
| US9856625B2 | Working vehicle | Physics | 1 | Active |
| US9534569B2 | Working vehicle | Fixed Constructions | 0 | Active |
| US5290015A | Method of producing high-melting-point and high-toughness metal and apparatus for the same | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6070735A | Sputtering apparatus simulation method | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.