Electrostatic chuck having composite dielectric layer and method of manufacture

US6721162B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Edwin C. Weldon · Los Gatos, US
• Kenneth S. Collins · San Jose, US
• Arik Donde · Dallas, US
• Brian Lue · Mountain View, US
• Dan Maydan · Los Altos Hills, US
• Robert Steger · Cupertino, US
• Timothy Dyer · Tempe, US
• Ananda H. Kumar · Fremont, US
• Alexander Veytser · Mountain View, US
• Kadthala Ramaya Narendrnath · San Jose, US
• Semyon L. Kats · San Francisco, US
• Arnold Kholodenko · San Francisco, US
• Shamouil Shamouilian · San Jose, US
• Dennis S. Grimard · Ann Arbor, US

Key dates

• Filing date: Mar 12, 2002
• Grant date: Apr 13, 2004
• Expiry date: Mar 12, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T279/23
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electrostatic chuck has an electrode capable of being electrically charged to electrostatically hold a substrate. A composite layer covers the electrode. The composite layer comprises (1) a first dielectric material covering a central portion of the electrode, and (2) a second dielectric material covering a peripheral portion of the electrode, the second dielectric material having a different composition than the composition of the first dielectric material. The chuck is useful in a plasma process chamber to process substrates, such as semiconductor wafers.