Multi-chemistry plating system
US7223323B2 · kind B2 · utility
31Cited by
93References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2003 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Feb 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.