Patent assignee · US · COMPANY

NIKON PRECISION INC.

42Patents
10Active
42Granted
41Portfolio score

Filing activity: Feb 20, 1990 → Aug 30, 2017 · 4 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US5825043A Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus Physics 1,043 Expired
US6191429A Projection exposure apparatus and method with workpiece area detection Physics 611 Expired
US5623853A Precision motion stage with single guide beam and follower stage Emerging Cross-Sectional Technologies 464 Expired
US5528118A Guideless stage with isolated reaction stage Emerging Cross-Sectional Technologies 460 Expired
US5515207A Multiple mirror catadioptric optical system Physics 76 Expired
US6842223B2 Enhanced illuminator for use in photolithographic systems Physics 74 Expired
US5323263A Off-axis catadioptric projection system Physics 70 Expired
US5760564A Dual guide beam stage mechanism with yaw control Performing Operations; Transporting 67 Expired
US5453814A Illumination source and method for microlithography Physics 63 Expired
US5437946A Multiple reticle stitching for scanning exposure system Physics 42 Expired
US6750952B2 Apparatus for preforming measurement of a dimension of a test mark for semiconductor processing Physics 42 Expired
US5631731A Method and apparatus for aerial image analyzer Physics 41 Expired
US5552888A Apparatus for measuring position of an X-Y stage Physics 36 Expired
US5835227A Method and apparatus for determining performance characteristics in lithographic tools Physics 27 Expired
US5866935A Tunneling device Physics 23 Expired
US6664121B2 Method and apparatus for position measurement of a pattern formed by a lithographic exposure tool Physics 23 Expired
US4991160A Integrated optical device for magneto-optical recording and reading head Physics 20 Expired
US6094256A Method for forming a critical dimension test structure and its use Physics 19 Expired
US5838450A Direct reticle to wafer alignment using fluorescence for integrated circuit lithography Physics 16 Expired
US6974653B2 Methods for critical dimension and focus mapping using critical dimension test marks Physics 15 Expired
US5729343A Film thickness measurement apparatus with tilting stage and method of operation Physics 15 Expired
US5602619A Scanner for step and scan lithography system Physics 13 Expired
US6449031B1 Method for use of a critical dimensional test structure Physics 10 Expired
US8365107B2 Scanner based optical proximity correction system and method of use Physics 9 Active
US6436589B1 Reticle having an interleave kerf Physics 9 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.