Inventor · Fishkill, NY, US

Albert M. Young

44Patents
9h-index
86Co-inventors
78Inventor score

Filing activity: May 7, 1999 → Mar 14, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6396298B1 Active feedback pulsed measurement method Physics 101 Expired
US8546188B2 Bow-balanced 3D chip stacking Electricity 62 Active
US6177836A Feed forward linearized traveling wave tube Electricity 37 Expired
US7214346B2 Optoelectronic detection system Emerging Cross-Sectional Technologies 20 Expired
US7217513B2 Apparatus and method for isolating a nucleic acid from a sample Performing Operations; Transporting 17 Expired
US6127899A High frequency anharmonic oscillator for the generation of broadband deterministic noise Electricity 17 Expired
US7913202B2 Wafer level I/O test, repair and/or customization enabled by I/O layer Physics 16 Active
US7521950B2 Wafer level I/O test and repair enabled by I/O layer Physics 16 Active
US7256649B2 Multiple signal intermodulation reduction system Electricity 15 Expired
US7129783B2 Hybrid active combiner and circulator Electricity 9 Expired
US7683478B2 Hermetic seal and reliable bonding structures for 3D applications Electricity 7 Active
US7947509B2 Optoelectronic detection system Emerging Cross-Sectional Technologies 7 Active
US7847597B1 Precision frequency change detector Physics 6 Active
US8298914B2 3D integrated circuit device fabrication using interface wafer as permanent carrier Electricity 5 Active
US7528056B2 Low-cost strained SOI substrate for high-performance CMOS technology Electricity 5 Active
US7545667B2 Programmable via structure for three dimensional integration technology Electricity 4 Active
US8492869B2 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer Electricity 4 Active
US7999377B2 Method and structure for optimizing yield of 3-D chip manufacture Electricity 2 Active
US7737003B2 Method and structure for optimizing yield of 3-D chip manufacture Electricity 2 Active
US9005989B2 Optoelectronic detection system Emerging Cross-Sectional Technologies 2 Active
US7652278B2 Programmable via structure and method of fabricating same Electricity 2 Active
US7786596B2 Hermetic seal and reliable bonding structures for 3D applications Electricity 2 Active
US7732798B2 Programmable via structure for three dimensional integration technology Electricity 2 Active
US8828800B2 Method of forming adaptive interconnect structure having programmable contacts Electricity 1 Active
US8399336B2 Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.