Inventor · Chunri, TW

Ching-Yang Wen

17Patents
1h-index
16Co-inventors
43Inventor score

Filing activity: Mar 22, 2018 → Apr 18, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10923599B2 Semiconductor device Electricity 3 Active
US12191195B2 Method of fabricating an air gap Electricity 1 Active
US11670567B2 Semiconductor structure and method of wafer bonding Electricity 1 Active
US10763170B2 Semiconductor device including buried insulation layer and manufacturing method thereof Electricity 1 Active
US11715709B2 Manufacturing method of radiofrequency device including mold compound layer Electricity 0 Active
US12300534B2 Method of forming protective layer utilized in silicon remove process Electricity 0 Active
US11398548B2 Semiconductor device Electricity 0 Active
US11929213B2 Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same Electricity 0 Active
US11362048B2 Radiofrequency device and manufacturing method thereof Electricity 0 Active
US11881529B2 Semiconductor device and method of fabricating the same Electricity 0 Active
US11955292B2 Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same Electricity 0 Active
US11476363B2 Semiconductor device and method of fabricating the same Electricity 0 Active
US10903314B2 Semiconductor device and method for manufacturing the same Electricity 0 Active
US11923373B2 Semiconductor structure Electricity 0 Active
US12324168B2 Semiconductor device and manufacturing method thereof Electricity 0 Active
US12080622B2 Semiconductor structure and method of wafer bonding Electricity 0 Active
US11296023B2 Semiconductor device and method of fabricating the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.