Inventor · Tainan, TW

Hsiang-Wei Liu

49Patents
5h-index
37Co-inventors
69Inventor score

Filing activity: Oct 2, 1996 → Jul 26, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10020261B2 Split rail structures located in adjacent metal layers Electricity 29 Active
US10269715B2 Split rail structures located in adjacent metal layers Electricity 28 Active
US5824457A Use of WEE (wafer edge exposure) to prevent polyimide contamination Emerging Cross-Sectional Technologies 18 Expired
US9607881B2 Insulator void aspect ratio tuning by selective deposition Electricity 10 Active
US6001681A Method to reduce the depth of a buried contact trench by using a thin split polysilicon thickness Electricity 7 Expired
US10290580B2 Hybrid copper structure for advance interconnect usage Electricity 5 Active
US9837354B2 Hybrid copper structure for advance interconnect usage Electricity 5 Active
US10147609B2 Semiconductor epitaxy bordering isolation structure Electricity 4 Active
US6819556B2 Server system and vibration-free extractable hard disc drive assembly thereof Physics 4 Expired
US9219494B2 Dual mode analog to digital converter Electricity 3 Active
US10930551B2 Methods for fabricating a low-resistance interconnect Electricity 2 Active
US11729969B1 Semiconductor device and method of operating the same Electricity 2 Active
US10522353B2 Semiconductor epitaxy bordering isolation structure Electricity 2 Active
US10529617B2 Metal routing with flexible space formed using self-aligned spacer patterning Electricity 2 Active
US9583434B2 Metal line structure and method Electricity 2 Active
US10534273B2 Multi-metal fill with self-aligned patterning and dielectric with voids Electricity 2 Active
US10957540B2 Semiconductor epitaxy bordering isolation structure Electricity 1 Active
US10658296B2 Dielectric film for semiconductor fabrication Electricity 1 Active
US11302570B2 Interconnect structure and method for forming the same Electricity 1 Active
US10957580B2 Metal routing with flexible space formed using self-aligned spacer patterning Electricity 1 Active
US10734275B2 Metal routing with flexible space formed using self-aligned spacer patterning Electricity 1 Active
US8779959B1 Method of dynamic element matching and an apparatus thereof Electricity 1 Active
US7307838B2 Hard disc drive carrier Physics 1 Expired
US11107725B2 Interconnect structure and manufacturing method for the same Electricity 0 Active
US11860550B2 Multi-metal fill with self-aligned patterning and dielectric with voids Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.