Jason E. Cummings
10Patents
4h-index
28Co-inventors
49Inventor score
Filing activity: Oct 1, 2009 → Mar 15, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8513127B2 | Chemical mechanical planarization processes for fabrication of FinFET devices | Electricity | 9 | Active |
| US8110483B2 | Forming an extremely thin semiconductor-on-insulator (ETSOI) layer | Electricity | 5 | Active |
| US8524606B2 | Chemical mechanical planarization with overburden mask | Electricity | 5 | Active |
| US8790991B2 | Method and structure for shallow trench isolation to mitigate active shorts | Electricity | 4 | Active |
| US8232179B2 | Method to improve wet etch budget in FEOL integration | Electricity | 1 | Active |
| US9018024B2 | Creating extremely thin semiconductor-on-insulator (ETSOI) having substantially uniform thickness | Emerging Cross-Sectional Technologies | 0 | Active |
| US9263517B2 | Extremely thin semiconductor-on-insulator (ETSOI) layer | Electricity | 0 | Active |
| US8679941B2 | Method to improve wet etch budget in FEOL integration | Electricity | 0 | Active |
| US8507383B2 | Fabrication of replacement metal gate devices | Electricity | 0 | Active |
| US8497210B2 | Shallow trench isolation chemical mechanical planarization | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.