Inventor · Daxi District, TW

Jengping Lin

15Patents
9h-index
9Co-inventors
57Inventor score

Filing activity: Jan 6, 1995 → Apr 3, 2000

Most-cited inventions

PatentTitleAreaCited byStatus
US5502009A Method for fabricating gate oxide layers of different thicknesses Emerging Cross-Sectional Technologies 84 Expired
US5510279A Method of fabricating an asymmetric lightly doped drain transistor device Electricity 56 Expired
US5663586A Fet device with double spacer Emerging Cross-Sectional Technologies 35 Expired
US5550079A Method for fabricating silicide shunt of dual-gate CMOS device Electricity 31 Expired
US5504038A Method for selective tungsten sidewall and bottom contact formation Electricity 23 Expired
US5641698A Method of fabricating FET device with double spacer Emerging Cross-Sectional Technologies 22 Expired
US5547900A Method of fabricating a self-aligned contact using a liquid-phase oxide-deposition process Electricity 15 Expired
US5679602A Method of forming MOSFET devices with heavily doped local channel stops Emerging Cross-Sectional Technologies 13 Expired
US5612239A Use of oxide spacers formed by liquid phase deposition Electricity 11 Expired
US5550074A Process for fabricating MOS transistors having anti-punchthrough implant regions formed by the use of a phase-shift mask Emerging Cross-Sectional Technologies 5 Expired
US5652160A Method of fabricating a buried contact structure with WSi.sub.x sidewall spacers Electricity 4 Expired
US5966604A Method of manufacturing MOS components having lightly doped drain structures Electricity 3 Expired
US6215546A Method of optical correction for improving the pattern shrinkage caused by scattering of the light Physics 2 Expired
US6303491A Method for fabricating self-aligned contact hole Electricity 2 Expired
US6107175A Method of fabricating self-aligned contact Electricity 2 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.