Kenlin Huang
10Patents
7h-index
18Co-inventors
59Inventor score
Filing activity: May 17, 1996 → Aug 7, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7408212B1 | Stackable resistive cross-point memory with schottky diode isolation | Electricity | 68 | Expired |
| US8772051B1 | Fabrication method for embedded magnetic memory | Electricity | 31 | Active |
| US5827437A | Multi-step metallization etch | Electricity | 23 | Expired |
| US7972959B2 | Self aligned double patterning flow with non-sacrificial features | Electricity | 17 | Active |
| US8803293B2 | Method to reduce magnetic film stress for better yield | Electricity | 12 | Active |
| US8933542B2 | Method to reduce magnetic film stress for better yield | Electricity | 12 | Active |
| US7186658B2 | Method and resulting structure for PCMO film to obtain etching rate and mask to selectively by inductively coupled plasma | Electricity | 7 | Expired |
| US6638874B2 | Methods used in fabricating gates in integrated circuit device structures | Electricity | 4 | Expired |
| US6635577B1 | Method for reducing topography dependent charging effects in a plasma enhanced semiconductor wafer processing system | Electricity | 3 | Expired |
| US7172939B1 | Method and structure for fabricating non volatile memory arrays | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.