Inventor · Baoshan, TW

Ming Yang

14Patents
9h-index
14Co-inventors
65Inventor score

Filing activity: Sep 8, 1992 → Jun 27, 2003

Most-cited inventions

PatentTitleAreaCited byStatus
US5393702A Via sidewall SOG nitridation for via filling Electricity 39 Expired
US6277720A Silicon nitride dopant diffusion barrier in integrated circuits Electricity 35 Expired
US5554550A Method of fabricating electrically eraseable read only memory cell having a trench Electricity 32 Expired
US6605540B2 Process for forming a dual damascene structure Electricity 13 Expired
US5763020A Process for evenly depositing ions using a tilting and rotating platform Chemistry; Metallurgy 13 Expired
US5512507A Process for post metal coding of a ROM, by gate etch Electricity 12 Expired
US5914279A Silicon nitride sidewall and top surface layer separating conductors Electricity 12 Expired
US5264386A Read only memory manufacturing method Emerging Cross-Sectional Technologies 10 Expired
US6803273B1 Method to salicide source-line in flash memory with STI Electricity 9 Expired
US5759282A Process for evenly depositing ions using a tilting and rotating platform Chemistry; Metallurgy 6 Expired
US7112532B2 Process for forming a dual damascene structure Electricity 4 Expired
US5972796A In-situ barc and nitride etch process Electricity 2 Expired
US6930049B2 Endpoint control for small open area by RF source parameter Vdc Electricity 1 Expired
US6274481A Process sequence to improve DRAM data retention Electricity 1 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.