Roy R. Yu
15Patents
4h-index
28Co-inventors
60Inventor score
Filing activity: Dec 22, 1999 → Nov 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8129256B2 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Electricity | 249 | Active |
| US8546188B2 | Bow-balanced 3D chip stacking | Electricity | 62 | Active |
| US6339527B1 | Thin film capacitor on ceramic | Electricity | 25 | Expired |
| US8298914B2 | 3D integrated circuit device fabrication using interface wafer as permanent carrier | Electricity | 5 | Active |
| US8492869B2 | 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Electricity | 4 | Active |
| US8664081B2 | Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Electricity | 1 | Active |
| US8629553B2 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Electricity | 1 | Active |
| US8399336B2 | Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Electricity | 1 | Active |
| US11915966B2 | Backside power rail integration | Electricity | 0 | Active |
| US12106969B2 | Substrate thinning for a backside power distribution network | Electricity | 0 | Active |
| US9171742B2 | Alignment of integrated circuit chip stack | Electricity | 0 | Active |
| US12002758B2 | Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer | Electricity | 0 | Active |
| US8738167B2 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Electricity | 0 | Active |
| US8962448B2 | Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Electricity | 0 | Active |
| US12136655B2 | Backside electrical contacts to buried power rails | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.