Sunil Hattangady
21Patents
14h-index
24Co-inventors
77Inventor score
Filing activity: Dec 3, 1990 → Feb 19, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6136654A | Method of forming thin silicon nitride or silicon oxynitride gate dielectrics | Electricity | 127 | Expired |
| US6110842A | Method of forming multiple gate oxide thicknesses using high density plasma nitridation | Emerging Cross-Sectional Technologies | 85 | Expired |
| US6610614B2 | Method for uniform nitridization of ultra-thin silicon dioxide layers in transistor gates | Electricity | 51 | Expired |
| US6251761A | Process for polycrystalline silicon gates and high-K dielectric compatibility | Electricity | 49 | Expired |
| US5989962A | Semiconductor device having dual gate and method of formation | Electricity | 38 | Expired |
| US6632747B2 | Method of ammonia annealing of ultra-thin silicon dioxide layers for uniform nitrogen profile | Electricity | 38 | Expired |
| US6331492A | Nitridation for split gate multiple voltage devices | Emerging Cross-Sectional Technologies | 37 | Expired |
| US5970345A | Method of forming an integrated circuit having both low voltage and high voltage MOS transistors | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6399445B1 | Fabrication technique for controlled incorporation of nitrogen in gate dielectric | Electricity | 32 | Expired |
| US6140024A | Remote plasma nitridation for contact etch stop | Electricity | 30 | Expired |
| US6268296A | Low temperature process for multiple voltage devices | Electricity | 30 | Expired |
| US6323114A | Stacked/composite gate dielectric which incorporates nitrogen at an interface | Electricity | 28 | Expired |
| US6261973A | Remote plasma nitridation to allow selectively etching of oxide | Electricity | 21 | Expired |
| US6716695B1 | Semiconductor with a nitrided silicon gate oxide and method | Electricity | 17 | Expired |
| US6277681A | Process to produce ultrathin crystalline silicon nitride on Si(111) for advanced gate dielectrics | Electricity | 11 | Expired |
| US6956267B2 | Semiconductor with a nitrided silicon gate oxide and method | Electricity | 9 | Expired |
| US5168330A | Semiconductor device having a semiconductor substrate interfaced to a dissimilar material by means of a single crystal pseudomorphic interlayer | Electricity | 8 | Expired |
| US6780719B2 | Method for annealing ultra-thin, high quality gate oxide layers using oxidizer/hydrogen mixtures | Electricity | 4 | Expired |
| US6420729B1 | Process to produce ultrathin crystalline silicon nitride on Si (111) for advanced gate dielectrics | Electricity | 2 | Expired |
| US6352941B1 | Controllable oxidation technique for high quality ultrathin gate oxide formation | Electricity | 2 | Expired |
| US6423648B1 | Controllable oxidation technique for the formation of high-quality ultra-thin gate oxide using carbon dioxide as the oxidizing agent | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.