William Crew
11Patents
10h-index
13Co-inventors
65Inventor score
Filing activity: Sep 24, 2003 → Oct 30, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7851232B2 | UV treatment for carbon-containing low-k dielectric repair in semiconductor processing | Electricity | 547 | Active |
| US7282438B1 | Low-k SiC copper diffusion barrier films | Emerging Cross-Sectional Technologies | 42 | Expired |
| US7239017B1 | Low-k B-doped SiC copper diffusion barrier films | Electricity | 38 | Expired |
| US7420275B1 | Boron-doped SIC copper diffusion barrier films | Electricity | 37 | Active |
| US6967405B1 | Film for copper diffusion barrier | Electricity | 34 | Expired |
| US7163889B2 | Film for copper diffusion barrier | Electricity | 25 | Expired |
| US7573061B1 | Low-k SiC copper diffusion barrier films | Emerging Cross-Sectional Technologies | 22 | Active |
| US7842604B1 | Low-k b-doped SiC copper diffusion barrier films | Electricity | 17 | Active |
| US7041543B1 | Strained transistor architecture and method | Electricity | 16 | Expired |
| US7968436B1 | Low-K SiC copper diffusion barrier films | Emerging Cross-Sectional Technologies | 15 | Active |
| US9484251B1 | Contact integration for reduced interface and series contact resistance | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.