Inventor · Incheon, KR

Cha-Jea Jo

33Patents
7h-index
45Co-inventors
65Inventor score

Filing activity: Jan 15, 2007 → Mar 28, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9997446B2 Semiconductor package including a rewiring layer with an embedded chip Electricity 19 Active
US10026724B2 Semiconductor package and method of manufacturing the same Electricity 17 Active
US9589945B2 Semiconductor package having stacked semiconductor chips Electricity 12 Active
US9666551B1 Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip Electricity 10 Active
US10083939B2 Semiconductor package Electricity 8 Active
US10224272B2 Semiconductor package including a rewiring layer with an embedded chip Electricity 8 Active
US7626260B2 Stack-type semiconductor device having cooling path on its bottom surface Electricity 7 Active
US10141286B2 Methods of manufacturing semiconductor packages Electricity 6 Active
US8912048B2 Method of fabricating semiconductor device including a substrate attached to a carrier Electricity 4 Active
US8088648B2 Method of manufacturing a chip stack package Electricity 4 Active
US10134702B2 Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip Electricity 3 Active
US10658341B2 Semiconductor package Electricity 3 Active
US11244936B2 Semiconductor device package and apparatus comprising the same Electricity 2 Active
US10680025B2 Semiconductor package and image sensor Electricity 2 Active
US10373935B2 Semiconductor package Electricity 2 Active
US9543231B2 Stacked semiconductor package Electricity 1 Active
US11018026B2 Interposer, semiconductor package, and method of fabricating interposer Electricity 1 Active
US10867970B2 Semiconductor package Electricity 1 Active
US11637140B2 Image sensor package Electricity 1 Active
US7638365B2 Stacked chip package and method for forming the same Electricity 1 Active
US10971535B2 Image sensor package Electricity 1 Active
US8178969B2 Flip chip package Electricity 1 Active
US10535534B2 Method of fabricating an interposer Electricity 1 Active
US8980689B2 Method of fabricating semiconductor multi-chip stack packages Electricity 1 Active
US11610865B2 Semiconductor package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.