Linnell Martinez
29Patents
5h-index
20Co-inventors
65Inventor score
Filing activity: Mar 5, 2012 → Apr 7, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8785332B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 14 | Active |
| US8802545B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 11 | Active |
| US8691702B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 8 | Active |
| US8778806B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 7 | Active |
| US9711406B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 5 | Active |
| US9082839B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 3 | Active |
| US9070760B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 2 | Active |
| US8796154B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 2 | Active |
| US11315757B2 | Method and apparatus to enhance sheath formation, evolution and pulse to pulse stability in RF powered plasma applications | Electricity | 1 | Active |
| US9105705B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US9343365B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US11996274B2 | Real-time, non-invasive IEDF plasma sensor | Electricity | 1 | Active |
| US9911654B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US9368404B2 | Method for dicing a substrate with back metal | Electricity | 0 | Active |
| US11488865B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
| US8946058B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
| US10497621B2 | Method for dicing a substrate with back metal | Electricity | 0 | Active |
| US10741447B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
| US9202737B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
| US8980764B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US11747494B2 | Ion filter using aperture plate with plurality of zones | Electricity | 0 | Active |
| US9496177B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 0 | Active |
| US10707060B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9202721B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9202720B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.