Michael Grillberger
13Patents
5h-index
13Co-inventors
55Inventor score
Filing activity: Jul 1, 2008 → Mar 9, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8598714B2 | Semiconductor device comprising through hole vias having a stress relaxation mechanism | Electricity | 11 | Active |
| US8399335B2 | Sophisticated metallization systems in semiconductors formed by removing damaged dielectric layers after forming the metal features | Electricity | 7 | Active |
| US8357610B2 | Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics | Electricity | 5 | Active |
| US7982313B2 | Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability | Electricity | 5 | Active |
| US8080866B2 | 3-D integrated semiconductor device comprising intermediate heat spreading capabilities | Electricity | 5 | Active |
| US8497583B2 | Stress reduction in chip packaging by a stress compensation region formed around the chip | Electricity | 5 | Active |
| US8479578B2 | Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts | Electricity | 4 | Active |
| US8482123B2 | Stress reduction in chip packaging by using a low-temperature chip-package connection regime | Electricity | 1 | Active |
| US10014279B2 | Methods of forming 3-D integrated semiconductor devices having intermediate heat spreading capabilities | Electricity | 1 | Active |
| US7829357B2 | Method and test structure for monitoring CMP processes in metallization layers of semiconductor devices | Electricity | 1 | Active |
| US8501545B2 | Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime | Electricity | 1 | Active |
| US9318468B2 | 3-D integrated semiconductor device comprising intermediate heat spreading capabilities | Electricity | 1 | Active |
| US8920027B2 | Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.