Shahab Siddiqui
54Patents
7h-index
85Co-inventors
75Inventor score
Filing activity: Oct 2, 2001 → Oct 15, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10106892B1 | Thermal oxide equivalent low temperature ALD oxide for dual purpose gate oxide and method for producing the same | Electricity | 402 | Active |
| US8421077B2 | Replacement gate MOSFET with self-aligned diffusion contact | Electricity | 32 | Active |
| US8373239B2 | Structure and method for replacement gate MOSFET with self-aligned contact using sacrificial mandrel dielectric | Electricity | 23 | Active |
| US9741720B1 | Higher ‘K’ gate dielectric cap for replacement metal gate (RMG) FINFET devices | Electricity | 14 | Active |
| US6638878B2 | Film planarization for low-k polymers used in semiconductor structures | Emerging Cross-Sectional Technologies | 10 | Expired |
| US8836037B2 | Structure and method to form input/output devices | Electricity | 7 | Active |
| US8941177B2 | Semiconductor devices having different gate oxide thicknesses | Electricity | 7 | Active |
| US7531444B2 | Method to create air gaps using non-plasma processes to damage ILD materials | Electricity | 6 | Expired |
| US8952460B2 | Germanium oxide free atomic layer deposition of silicon oxide and high-k gate dielectric on germanium containing channel for CMOS devices | Electricity | 6 | Active |
| US8159060B2 | Hybrid bonding interface for 3-dimensional chip integration | Electricity | 6 | Active |
| US9515164B2 | Methods and structure to form high K metal gate stack with single work-function metal | Electricity | 5 | Active |
| US7407554B2 | Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent | Emerging Cross-Sectional Technologies | 5 | Active |
| US8349729B2 | Hybrid bonding interface for 3-dimensional chip integration | Electricity | 4 | Active |
| US9087722B2 | Semiconductor devices having different gate oxide thicknesses | Electricity | 4 | Active |
| US9029959B2 | Composite high-k gate dielectric stack for reducing gate leakage | Electricity | 3 | Active |
| US9040369B2 | Structure and method for replacement gate MOSFET with self-aligned contact using sacrificial mandrel dielectric | Electricity | 3 | Active |
| US9741657B2 | TSV deep trench capacitor and anti-fuse structure | Electricity | 3 | Active |
| US8415772B2 | Method to prevent surface decomposition of III-V compound semiconductors | Electricity | 3 | Active |
| US7645694B2 | Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent | Emerging Cross-Sectional Technologies | 3 | Active |
| US8643115B2 | Structure and method of Tinv scaling for high κ metal gate technology | Electricity | 3 | Active |
| US11515427B2 | Precise bottom junction formation for vertical transport field effect transistor with highly doped epitaxial source/drain, sharp junction gradient, and/or reduced parasitic capacitance | Electricity | 2 | Active |
| US9006064B2 | Multi-plasma nitridation process for a gate dielectric | Electricity | 2 | Active |
| US9224826B2 | Multiple thickness gate dielectrics for replacement gate field effect transistors | Electricity | 2 | Active |
| US9087784B2 | Structure and method of Tinv scaling for high k metal gate technology | Electricity | 2 | Active |
| US9673108B1 | Fabrication of higher-K dielectrics | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.