Shane Lavan
15Patents
2h-index
25Co-inventors
43Inventor score
Filing activity: Apr 13, 2020 → Jun 19, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11600761B2 | High critical temperature metal nitride layer with oxide or oxynitride seed layer | Physics | 3 | Active |
| US11915918B2 | Cleaning of sin with CCP plasma or RPS clean | Electricity | 2 | Active |
| US11572618B2 | Method and chamber for backside physical vapor deposition | Electricity | 1 | Active |
| US11600477B2 | Gas injection process kit to eliminate arcing and improve uniform gas distribution for a PVD process | Electricity | 1 | Active |
| US11678589B2 | Method of making high critical temperature metal nitride layer | Physics | 1 | Active |
| US11469096B2 | Method and chamber for backside physical vapor deposition | Electricity | 1 | Active |
| US12142478B2 | Method and chamber for backside physical vapor deposition | Electricity | 0 | Active |
| US12183560B2 | Gas injection process kit to eliminate arcing and improve uniform gas distribution for a PVD process | Electricity | 0 | Active |
| US12185643B2 | High critical temperature metal nitride layer with oxide or oxynitride seed layer | Physics | 0 | Active |
| US11450514B1 | Methods of reducing particles in a physical vapor deposition (PVD) chamber | Electricity | 0 | Active |
| USD1072774S1 | Target profile for a physical vapor deposition chamber target | General | 0 | Active |
| US12052935B2 | Method of making high critical temperature metal nitride layer | Physics | 0 | Active |
| US12176205B2 | Method and chamber for backside physical vapor deposition | Electricity | 0 | Active |
| US12027354B2 | Cleaning of SIN with CCP plasma or RPS clean | Electricity | 0 | Active |
| US12096701B2 | Method of making high critical temperature metal nitride layer | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.