Inventor · Seoul, KR

Jongyoun Kim

37Patents
2h-index
16Co-inventors
46Inventor score

Filing activity: May 24, 2017 → Jul 3, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10950539B2 Redistribution substrate, method of fabricating the same, and semiconductor package including the same Electricity 4 Active
US10833002B2 Connection structure and method of forming the same Electricity 4 Active
US10319650B2 Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same Electricity 2 Active
US11145611B2 Semiconductor package and method of manufacturing the same Electricity 2 Active
US11437310B2 Connection structure and method of forming the same Electricity 2 Active
US10741518B2 Method of fabricating semiconductor package Electricity 2 Active
US11373954B2 Semiconductor package Electricity 2 Active
US11929316B2 Semiconductor package and method of fabricating the same Electricity 1 Active
US12057435B2 Semiconductor package Electricity 1 Active
US11456241B2 Semiconductor package Electricity 1 Active
US11901276B2 Semiconductor package and method of manufacturing the same Electricity 1 Active
US11646260B2 Semiconductor package and method of fabricating the same Electricity 1 Active
US11948872B2 Semiconductor package and method of fabricating the same Electricity 1 Active
US10546829B2 Method of fabricating semiconductor package Electricity 1 Active
US11869835B2 Semiconductor package Electricity 0 Active
US12068270B2 Semiconductor package Electricity 0 Active
US11387192B2 Semiconductor package Electricity 0 Active
US12211777B2 Semiconductor package including a dummy pattern Electricity 0 Active
US12230556B2 Semiconductor package and method of fabricating the same Electricity 0 Active
US12243813B2 Connection structure and method of forming the same Electricity 0 Active
US12300625B2 Semiconductor package including outer conductive plate Electricity 0 Active
US12293989B2 Semiconductor package Electricity 0 Active
US11837551B2 Semiconductor package Electricity 0 Active
US11973028B2 Redistribution substrate, method of fabricating the same, and semiconductor package including the same Electricity 0 Active
US11018108B2 Method of fabricating semiconductor package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.