Inventor · Happy Valley, OR, US

Nathan Stafford

30Patents
3h-index
32Co-inventors
59Inventor score

Filing activity: Dec 11, 2008 → Oct 25, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9514959B2 Fluorocarbon molecules for high aspect ratio oxide etch Chemistry; Metallurgy 12 Active
US10629451B1 Method to improve profile control during selective etching of silicon nitride spacers Electricity 4 Active
US10410878B2 Hydrofluorocarbons containing —NH2 functional group for 3D NAND and DRAM applications Electricity 4 Active
US10607850B2 Iodine-containing compounds for etching semiconductor structures Electricity 3 Active
US10529581B2 SiN selective etch to SiO2 with non-plasma dry process for 3D NAND device applications Electricity 3 Active
US10103031B2 Chemistries for TSV/MEMS/power device etching Chemistry; Metallurgy 1 Active
US9892932B2 Chemistries for TSV/MEMS/power device etching Chemistry; Metallurgy 1 Active
US11430663B2 Iodine-containing compounds for etching semiconductor structures Electricity 1 Active
US8664446B1 Purification of trimethylamine Chemistry; Metallurgy 1 Active
US8191397B2 Methods for checking and calibrating concentration sensors in a semiconductor processing chamber Physics 1 Active
US11152223B2 Fluorocarbon molecules for high aspect ratio oxide etch Chemistry; Metallurgy 0 Active
US12224177B2 Method of running an etch process in higher selectivity to mask and polymer regime by using a cyclic etch process Electricity 0 Active
US11469110B2 Method to improve profile control during selective etching of silicon nitride spacers Electricity 0 Active
US10720335B2 Chemistries for TSV/MEMS/power device etching Chemistry; Metallurgy 0 Active
US10381240B2 Fluorocarbon molecules for high aspect ratio oxide etch Chemistry; Metallurgy 0 Active
US12188123B2 Deposition of iodine-containing carbon films Chemistry; Metallurgy 0 Active
US12083493B2 Selective adsorption of halocarbon impurities containing cl, br and i in fluorocarbons or hydrofluorocarbons using adsorbent supported metal oxide Performing Operations; Transporting 0 Active
US11024513B2 Methods for minimizing sidewall damage during low k etch processes Electricity 0 Active
US12106971B2 High conductive passivation layers and method of forming the same during high aspect ratio plasma etching Electricity 0 Active
US8974758B2 Methods of purifying COS Emerging Cross-Sectional Technologies 0 Active
US8361199B2 Purification of H2Se Performing Operations; Transporting 0 Active
US12341017B2 Etching methods with alternating non-plasma and plasma etching processes Electricity 0 Active
US12327731B2 Etching gas mixture and method of manufacturing integrated circuit device using the same Electricity 0 Active
US10115600B2 Method of etching semiconductor structures with etch gas Performing Operations; Transporting 0 Active
US10347498B2 Methods of minimizing plasma-induced sidewall damage during low K etch processes Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.