Nathan Stafford
30Patents
3h-index
32Co-inventors
59Inventor score
Filing activity: Dec 11, 2008 → Oct 25, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9514959B2 | Fluorocarbon molecules for high aspect ratio oxide etch | Chemistry; Metallurgy | 12 | Active |
| US10629451B1 | Method to improve profile control during selective etching of silicon nitride spacers | Electricity | 4 | Active |
| US10410878B2 | Hydrofluorocarbons containing —NH2 functional group for 3D NAND and DRAM applications | Electricity | 4 | Active |
| US10607850B2 | Iodine-containing compounds for etching semiconductor structures | Electricity | 3 | Active |
| US10529581B2 | SiN selective etch to SiO2 with non-plasma dry process for 3D NAND device applications | Electricity | 3 | Active |
| US10103031B2 | Chemistries for TSV/MEMS/power device etching | Chemistry; Metallurgy | 1 | Active |
| US9892932B2 | Chemistries for TSV/MEMS/power device etching | Chemistry; Metallurgy | 1 | Active |
| US11430663B2 | Iodine-containing compounds for etching semiconductor structures | Electricity | 1 | Active |
| US8664446B1 | Purification of trimethylamine | Chemistry; Metallurgy | 1 | Active |
| US8191397B2 | Methods for checking and calibrating concentration sensors in a semiconductor processing chamber | Physics | 1 | Active |
| US11152223B2 | Fluorocarbon molecules for high aspect ratio oxide etch | Chemistry; Metallurgy | 0 | Active |
| US12224177B2 | Method of running an etch process in higher selectivity to mask and polymer regime by using a cyclic etch process | Electricity | 0 | Active |
| US11469110B2 | Method to improve profile control during selective etching of silicon nitride spacers | Electricity | 0 | Active |
| US10720335B2 | Chemistries for TSV/MEMS/power device etching | Chemistry; Metallurgy | 0 | Active |
| US10381240B2 | Fluorocarbon molecules for high aspect ratio oxide etch | Chemistry; Metallurgy | 0 | Active |
| US12188123B2 | Deposition of iodine-containing carbon films | Chemistry; Metallurgy | 0 | Active |
| US12083493B2 | Selective adsorption of halocarbon impurities containing cl, br and i in fluorocarbons or hydrofluorocarbons using adsorbent supported metal oxide | Performing Operations; Transporting | 0 | Active |
| US11024513B2 | Methods for minimizing sidewall damage during low k etch processes | Electricity | 0 | Active |
| US12106971B2 | High conductive passivation layers and method of forming the same during high aspect ratio plasma etching | Electricity | 0 | Active |
| US8974758B2 | Methods of purifying COS | Emerging Cross-Sectional Technologies | 0 | Active |
| US8361199B2 | Purification of H2Se | Performing Operations; Transporting | 0 | Active |
| US12341017B2 | Etching methods with alternating non-plasma and plasma etching processes | Electricity | 0 | Active |
| US12327731B2 | Etching gas mixture and method of manufacturing integrated circuit device using the same | Electricity | 0 | Active |
| US10115600B2 | Method of etching semiconductor structures with etch gas | Performing Operations; Transporting | 0 | Active |
| US10347498B2 | Methods of minimizing plasma-induced sidewall damage during low K etch processes | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.