Szu-Yu Wang
44Patents
8h-index
31Co-inventors
71Inventor score
Filing activity: Jun 1, 2004 → Jul 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7060594B2 | Memory device and method of manufacturing including deuterated oxynitride charge trapping structure | Emerging Cross-Sectional Technologies | 44 | Expired |
| US7463530B2 | Operating method of non-volatile memory device | Electricity | 39 | Active |
| US7879738B2 | Charge trapping dielectric structure for non-volatile memory | Electricity | 34 | Active |
| US7688626B2 | Depletion mode bandgap engineered memory | Electricity | 32 | Active |
| US7642585B2 | Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays | Electricity | 31 | Active |
| US8315095B2 | Multi-gate bandgap engineered memory | Electricity | 30 | Active |
| US8264028B2 | Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays | Physics | 29 | Expired |
| US9209190B2 | Deep trench capacitor | Electricity | 12 | Active |
| US9184041B2 | Integrated circuit with backside structures to reduce substrate warp | Electricity | 8 | Active |
| US7405125B2 | Tunnel oxynitride in flash memories | Electricity | 5 | Expired |
| US7772072B2 | Method for manufacturing non-volatile memory | Electricity | 4 | Active |
| US10833026B2 | Integrated circuit with backside structures to reduce substrate warp | Electricity | 3 | Active |
| US10276513B2 | Integrated circuit with backside structures to reduce substrate warp | Electricity | 3 | Active |
| US8094497B2 | Multi-gate bandgap engineered memory | Electricity | 3 | Active |
| US9754827B1 | Semiconductor device and fabrication method thereof | Electricity | 3 | Active |
| US7529137B2 | Methods of operating bandgap engineered memory | Physics | 3 | Active |
| US9646938B2 | Integrated circuit with backside structures to reduce substrate warp | Electricity | 3 | Active |
| US9281203B2 | Silicon dot formation by direct self-assembly method for flash memory | Electricity | 2 | Active |
| US8730726B2 | Multi-gate bandgap engineered memory | Electricity | 2 | Active |
| US9401434B2 | E-flash cell band engineering for erasing speed enhancement | Electricity | 2 | Active |
| US10497860B2 | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method | Physics | 2 | Active |
| US9871095B2 | Stacked capacitor with enhanced capacitance and method of manufacturing the same | Electricity | 2 | Active |
| US10276678B2 | Semiconductor device and fabrication method thereof | Electricity | 1 | Active |
| US9755860B2 | Method of performing uplink channel estimation and base station using the same | Electricity | 1 | Active |
| US9385136B2 | Silicon dot formation by self-assembly method and selective silicon growth for flash memory | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.