Inventor · San Jose, CA, US

Tom A. Kamp

21Patents
6h-index
40Co-inventors
69Inventor score

Filing activity: Sep 4, 2002 → Jun 6, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9396961B2 Integrated etch/clean for dielectric etch applications Electricity 100 Active
US9620376B2 Self limiting lateral atomic layer etch Electricity 86 Active
US6921724B2 Variable temperature processes for tunable electrostatic chuck Electricity 73 Expired
US8852964B2 Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis Electricity 14 Active
US8901004B2 Plasma etch method to reduce micro-loading Electricity 11 Active
US6939811B2 Apparatus and method for controlling etch depth Electricity 9 Expired
US7851369B2 Hardmask trim method Electricity 5 Active
US9012243B2 Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis Electricity 4 Active
US11031215B2 Vacuum pump protection against deposition byproduct buildup Electricity 3 Active
US8124540B2 Hardmask trim method Electricity 2 Active
US10163610B2 Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation Electricity 1 Active
US10714354B2 Self limiting lateral atomic layer etch Electricity 1 Active
US10950454B2 Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method Electricity 1 Active
US12237203B2 System, method, and user interface for edge ring wear compensation Electricity 0 Active
US11710623B2 Vacuum pump protection against deposition byproduct buildup Electricity 0 Active
US9484214B2 Systems and methods for improving wafer etch non-uniformity when using transformer-coupled plasma Electricity 0 Active
US10600648B2 Silicon-based deposition for semiconductor processing Electricity 0 Active
US11538713B2 System and method for edge ring wear compensation Electricity 0 Active
US12087561B2 Vacuum pump protection against deposition byproduct buildup Electricity 0 Active
US9711359B2 Shadow trim line edge roughness reduction Electricity 0 Active
US10431426B2 Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systems Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.