Shinya Iida
20Patents
12h-index
26Co-inventors
81Inventor score
Filing activity: Jun 5, 1979 → Mar 30, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4745088A | Vapor phase growth on semiconductor wafers | Emerging Cross-Sectional Technologies | 127 | Expired |
| US6106728A | Slurry recycling system and method for CMP apparatus | Performing Operations; Transporting | 79 | Expired |
| US4581101A | Dry-etching process | Emerging Cross-Sectional Technologies | 49 | Expired |
| US4289188A | Method and apparatus for monitoring etching | Electricity | 47 | Expired |
| US4267013A | Method for dry-etching aluminum and aluminum alloys | Chemistry; Metallurgy | 42 | Expired |
| US4412119A | Method for dry-etching | Electricity | 26 | Expired |
| US6126531A | Slurry recycling system of CMP apparatus and method of same | Electricity | 25 | Expired |
| US6360687B1 | Wafer flattening system | Electricity | 23 | Expired |
| US4308089A | Method for preventing corrosion of Al and Al alloys | Electricity | 21 | Expired |
| US5980769A | Plasma etching method | Electricity | 20 | Expired |
| US6159082A | Slurry circulation type surface polishing machine | Performing Operations; Transporting | 15 | Expired |
| US6159388A | Plasma etching method and plasma etching system for carrying out the same | Electricity | 14 | Expired |
| US4427515A | Surface acoustic wave device and method for manufacturing the same | Electricity | 12 | Expired |
| US4352974A | Plasma etcher having isotropic subchamber with gas outlet for producing uniform etching | Electricity | 12 | Expired |
| US6306245A | Plasma etching apparatus | Electricity | 10 | Expired |
| US6280645A | Wafer flattening process and system | Electricity | 9 | Expired |
| US6254718A | Combined CMP and plasma etching wafer flattening system | Electricity | 3 | Expired |
| US6316369A | Corrosion-resistant system and method for a plasma etching apparatus | Electricity | 2 | Expired |
| US6451217B1 | Wafer etching method | Electricity | 1 | Expired |
| US6496748B1 | Wafer flattening process and storage medium | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.