Inventor · Villach, AT

Stefan Kramp

14Patents

2h-index

27Co-inventors

50Inventor score

Filing activity: Jul 25, 2008 → Aug 31, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8441804B2	Semiconductor device and method of manufacturing a semiconductor device	Electricity	2	Active
US10236265B2	Semiconductor chip and method for forming a chip pad	Electricity	2	Active
US9786620B2	Semiconductor device and a method for manufacturing a semiconductor device	Electricity	2	Active
US9905685B2	Semiconductor device and trench field plate field effect transistor with a field dielectric including thermally grown and deposited portions	Electricity	1	Active
US9435849B2	Method for testing semiconductor dies and a test apparatus	Physics	0	Active
US10418319B2	Method of manufacturing a semiconductor device	Electricity	0	Active
US11926769B2	Storage-stable, reactive, pressure-sensitive adhesive tape	Chemistry; Metallurgy	0	Active
US11043383B2	Electrical contact connection on silicon carbide substrate	Electricity	0	Active
US12327727B2	Chip with a silicon carbide substrate	Electricity	0	Active
US11798807B2	Process for producing an electrical contact on a silicon carbide substrate	Electricity	0	Active
US10636754B2	Semiconductor chip and method for forming a chip pad	Electricity	0	Active
US11217500B2	Semiconductor device and method for forming a semiconductor device	Electricity	0	Active
US11842938B2	Semiconductor device and method for forming a semiconductor device	Electricity	0	Active
US10018667B2	Method for testing semiconductor dies	Physics	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.