Zoltan Ring
24Patents
10h-index
15Co-inventors
68Inventor score
Filing activity: Apr 11, 2000 → Sep 26, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6475889B1 | Method of forming vias in silicon carbide and resulting devices and circuits | Electricity | 126 | Expired |
| US7045404B2 | Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof | Electricity | 123 | Expired |
| US6515303B2 | Method of forming vias in silicon carbide and resulting devices and circuits | Electricity | 113 | Expired |
| US7125786B2 | Method of forming vias in silicon carbide and resulting devices and circuits | Electricity | 112 | Expired |
| US6649497B2 | Method of forming vias in silicon carbide and resulting devices and circuits | Electricity | 106 | Expired |
| US6946739B2 | Layered semiconductor devices with conductive vias | Electricity | 102 | Expired |
| US7906799B2 | Nitride-based transistors with a protective layer and a low-damage recess | Electricity | 95 | Expired |
| US7855401B2 | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides | Electricity | 92 | Active |
| US7892974B2 | Method of forming vias in silicon carbide and resulting devices and circuits | Electricity | 71 | Active |
| US8563372B2 | Methods of forming contact structures including alternating metal and silicon layers and related devices | Electricity | 18 | Active |
| US7525122B2 | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides | Electricity | 10 | Expired |
| US7858460B2 | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides | Electricity | 8 | Active |
| US9812338B2 | Encapsulation of advanced devices using novel PECVD and ALD schemes | Electricity | 6 | Active |
| US9490169B2 | Method of forming vias in silicon carbide and resulting devices and circuits | Electricity | 3 | Active |
| US9934983B2 | Stress mitigation for thin and thick films used in semiconductor circuitry | Electricity | 3 | Active |
| US9142631B2 | Multilayer diffusion barriers for wide bandgap Schottky barrier devices | Electricity | 3 | Active |
| US9761439B2 | PECVD protective layers for semiconductor devices | Electricity | 2 | Active |
| US8202796B2 | Method of forming vias in silicon carbide and resulting devices and circuits | Electricity | 1 | Active |
| US8994073B2 | Hydrogen mitigation schemes in the passivation of advanced devices | Electricity | 1 | Active |
| US10367074B2 | Method of forming vias in silicon carbide and resulting devices and circuits | Electricity | 0 | Active |
| US9269662B2 | Using stress reduction barrier sub-layers in a semiconductor die | Electricity | 0 | Active |
| US9607955B2 | Contact pad | Electricity | 0 | Active |
| US11316028B2 | Nitride-based transistors with a protective layer and a low-damage recess | Electricity | 0 | Active |
| US9530647B2 | Devices including ultra-short gates and methods of forming same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.