Mark C. Gilmer
82Patents
19h-index
8Co-inventors
66Inventor score
Filing activity: Dec 10, 1996 → Jun 7, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6373113B1 | Nitrogenated gate structure for improved transistor performance and method for making same | Electricity | 76 | Expired |
| US6048766A | Flash memory device having high permittivity stacked dielectric and fabrication thereof | Electricity | 64 | Expired |
| US5937308A | Semiconductor trench isolation structure formed substantially within a single chamber | Electricity | 58 | Expired |
| US5840610A | Enhanced oxynitride gate dielectrics using NF.sub.3 gas | Electricity | 55 | Expired |
| US6169306A | Semiconductor devices comprised of one or more epitaxial layers | Electricity | 52 | Expired |
| US6096659A | Manufacturing process for reducing feature dimensions in a semiconductor | Emerging Cross-Sectional Technologies | 50 | Expired |
| US5907780A | Incorporating silicon atoms into a metal oxide gate dielectric using gas cluster ion beam implantation | Electricity | 46 | Expired |
| US6043157A | Semiconductor device having dual gate electrode material and process of fabrication thereof | Electricity | 40 | Expired |
| US5888870A | Memory cell fabrication employing an interpoly gate dielectric arranged upon a polished floating gate | Electricity | 39 | Expired |
| US6265749A | Metal silicide transistor gate spaced from a semiconductor substrate by a ceramic gate dielectric having a high dielectric constant | Electricity | 34 | Expired |
| US6051865A | Transistor having a barrier layer below a high permittivity gate dielectric | Electricity | 31 | Expired |
| US6110784A | Method of integration of nitrogen bearing high K film | Electricity | 31 | Expired |
| US6051487A | Semiconductor device fabrication using a sacrificial plug for defining a region for a gate electrode | Electricity | 26 | Expired |
| US6124620A | Incorporating barrier atoms into a gate dielectric using gas cluster ion beam implantation | Electricity | 26 | Expired |
| US6057584A | Semiconductor device having a tri-layer gate insulating dielectric | Electricity | 25 | Expired |
| US6197668A | Ferroelectric-enhanced tantalum pentoxide for dielectric material applications in CMOS devices | Electricity | 24 | Expired |
| US6002150A | Compound material T gate structure for devices with gate dielectrics having a high dielectric constant | Electricity | 24 | Expired |
| US6100204A | Method of making ultra thin gate oxide using aluminum oxide | Electricity | 22 | Expired |
| US5940698A | Method of making a semiconductor device having high performance gate electrode structure | Electricity | 20 | Expired |
| US5990493A | Diamond etch stop rendered conductive by a gas cluster ion beam implant of titanium | Electricity | 19 | Expired |
| US5821172A | Oxynitride GTE dielectrics using NH.sub.3 gas | Electricity | 19 | Expired |
| US5858848A | Semiconductor fabrication employing self-aligned sidewall spacers laterally adjacent to a transistor gate | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5963810A | Semiconductor device having nitrogen enhanced high permittivity gate insulating layer and fabrication thereof | Electricity | 18 | Expired |
| US6165314A | Apparatus for performing jet vapor reduction of the thickness of process layers | Electricity | 17 | Expired |
| US6148832A | Method and apparatus for in-situ cleaning of polysilicon-coated quartz furnaces | Chemistry; Metallurgy | 17 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.