Prasanna Khare
49Patents
8h-index
15Co-inventors
68Inventor score
Filing activity: May 22, 2008 → Feb 21, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8956942B2 | Method of forming a fully substrate-isolated FinFET transistor | Electricity | 35 | Active |
| US8759874B1 | FinFET device with isolated channel | Electricity | 30 | Active |
| US9093496B2 | Process for faciltiating fin isolation schemes | Electricity | 17 | Active |
| US8828851B2 | Method to enable the formation of silicon germanium channel of FDSOI devices for PFET threshold voltage engineering | Electricity | 12 | Active |
| US9166023B2 | Bulk finFET semiconductor-on-nothing integration | Electricity | 11 | Active |
| US9012999B2 | Semiconductor device with an inclined source/drain and associated methods | Electricity | 10 | Active |
| US9349730B2 | Fin transformation process and isolation structures facilitating different Fin isolation schemes | Electricity | 9 | Active |
| US9093556B2 | Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods | Electricity | 9 | Active |
| US9520393B2 | Fully substrate-isolated FinFET transistor | Electricity | 7 | Active |
| US9685380B2 | Method to co-integrate SiGe and Si channels for finFET devices | Electricity | 6 | Active |
| US9171757B2 | Dual shallow trench isolation liner for preventing electrical shorts | Electricity | 6 | Active |
| US8703550B2 | Dual shallow trench isolation liner for preventing electrical shorts | Electricity | 6 | Active |
| US8187975B1 | Hydrochloric acid etch and low temperature epitaxy in a single chamber for raised source-drain fabrication | Electricity | 6 | Active |
| US9000555B2 | Electronic device including shallow trench isolation (STI) regions with bottom nitride liner and upper oxide liner and related methods | Electricity | 5 | Active |
| US9082788B2 | Method of making a semiconductor device including an all around gate | Electricity | 5 | Active |
| US9437504B2 | Method for the formation of fin structures for FinFET devices | Electricity | 4 | Active |
| US9620507B2 | Silicon-on-nothing transistor semiconductor structure with channel epitaxial silicon-germanium region | Electricity | 4 | Active |
| US10062690B2 | Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods | Electricity | 4 | Active |
| US10340195B2 | Method to co-integrate SiGe and Si channels for finFET devices | Electricity | 3 | Active |
| US10170546B2 | Fully substrate-isolated FinFET transistor | Electricity | 3 | Active |
| US9099570B2 | Method for the formation of dielectric isolated fin structures for use, for example, in FinFET devices | Electricity | 3 | Active |
| US10170475B2 | Silicon-on-nothing transistor semiconductor structure with channel epitaxial silicon region | Electricity | 2 | Active |
| US9502292B2 | Dual shallow trench isolation liner for preventing electrical shorts | Electricity | 2 | Active |
| US9252052B2 | Dual shallow trench isolation liner for preventing electrical shorts | Electricity | 2 | Active |
| US9000491B2 | Layer formation with reduced channel loss | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.