Abbas Ali
53Patents
6h-index
63Co-inventors
75Inventor score
Filing activity: Jun 23, 1998 → Apr 11, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6171970A | Method for forming high-density integrated circuit capacitors | Electricity | 42 | Expired |
| US10490547B1 | IC with larger and smaller width contacts | Electricity | 14 | Active |
| US6605540B2 | Process for forming a dual damascene structure | Electricity | 13 | Expired |
| US11093135B1 | Drive performance, power, and temperature management | Emerging Cross-Sectional Technologies | 10 | Active |
| US6772380B1 | Smart tester and method for testing a bus connector | Physics | 7 | Expired |
| US7232748B2 | BARC/resist via etchback process | Electricity | 6 | Expired |
| US9502284B2 | Metal thin film resistor and process | Electricity | 6 | Active |
| US6774031B2 | Method of forming dual-damascene structure | Electricity | 5 | Expired |
| US7112532B2 | Process for forming a dual damascene structure | Electricity | 4 | Expired |
| US9431286B1 | Deep trench with self-aligned sinker | Electricity | 4 | Active |
| US9337292B1 | Very high aspect ratio contact | Electricity | 4 | Active |
| US10811543B2 | Semiconductor device with deep trench isolation and trench capacitor | Electricity | 3 | Active |
| US10032663B1 | Anneal after trench sidewall implant to reduce defects | Electricity | 2 | Active |
| US11195958B2 | Semiconductor device with deep trench isolation and trench capacitor | Electricity | 2 | Active |
| US9793364B2 | Substrate contact having substantially straight sidewalls to a top surface of the substrate | Electricity | 2 | Active |
| US7192877B2 | Low-K dielectric etch process for dual-damascene structures | Electricity | 2 | Expired |
| US6125414A | Terminating apparatus adapted to terminate single ended small computer system interface (SCSI) devices, low voltage differential SCSI devices, or high voltage differential SCSI devices | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10177214B2 | Metal thin film resistor and process | Electricity | 1 | Active |
| US10002774B1 | Metal interconnect processing for a non-reactive metal stack | Electricity | 1 | Active |
| US10665663B1 | IC with top side capacitor having lateral regions with thinned capacitor dielectric | Electricity | 1 | Active |
| US10716493B2 | Systems, methods, and apparatuses for peripheral arterial disease detection and mitigation thereof | Physics | 1 | Active |
| US10354951B1 | Thin film resistor with punch-through vias | Electricity | 1 | Active |
| US11642044B2 | Systems, methods, and apparatuses for peripheral arterial disease detection and mitigation thereof | Physics | 1 | Active |
| US10361095B2 | Metal interconnect processing for an integrated circuit metal stack | Electricity | 0 | Active |
| US11101212B2 | Thin film resistor with punch-through vias | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.