Inventor · Yongin-si, KR

Chajea Jo

35Patents

5h-index

47Co-inventors

65Inventor score

Filing activity: Mar 20, 2009 → Nov 14, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8802495B2	Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same	Electricity	276	Active
US8026592B2	Through-silicon via structures including conductive protective layers	Electricity	38	Active
US9461029B2	Semiconductor packages and methods for fabricating the same	Electricity	9	Active
US8129840B2	Semiconductor package and methods of manufacturing the same	Electricity	7	Active
US9245771B2	Semiconductor packages having through electrodes and methods for fabricating the same	Electricity	6	Active
US10361170B2	Semiconductor package	Electricity	5	Active
US9875992B2	Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same	Electricity	4	Active
US10186500B2	Semiconductor package and method of fabricating the same	Electricity	3	Active
US10121731B2	Semiconductor device	Electricity	3	Active
US10192855B2	Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line	Electricity	2	Active
US11444060B2	Semiconductor package	Electricity	2	Active
US11152416B2	Semiconductor package including a redistribution line	Electricity	1	Active
US11923342B2	Semiconductor package	Electricity	1	Active
US10510737B2	Semiconductor package	Electricity	1	Active
US11848293B2	Semiconductor package	Electricity	0	Active
US10734367B2	Semiconductor package and method of fabricating the same	Electricity	0	Active
US11990452B2	Semiconductor package	Electricity	0	Active
US11824076B2	Semiconductor package including an image sensor chip and a method of fabricating the same	Electricity	0	Active
US11545417B2	Integrated circuit device and semiconductor package including the same	Electricity	0	Active
US11942446B2	Semiconductor package and method of manufacturing the same	Electricity	0	Active
US11335719B2	Semiconductor package including an image sensor chip and a method of fabricating the same	Electricity	0	Active
US11158603B2	Semiconductor package and method of fabricating the same	Electricity	0	Active
US11545512B2	Image sensor package with underfill and image sensor module including the same	Electricity	0	Active
US12400980B2	Semiconductor package	Electricity	0	Active
US10651224B2	Semiconductor package including a redistribution line	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.