Inventor · Merced, CA, US

Chien Chiang

31Patents
19h-index
31Co-inventors
81Inventor score

Filing activity: Jun 26, 1996 → Oct 23, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US6339544B1 Method to enhance performance of thermal resistor device Electricity 429 Expired
US6621095B2 Method to enhance performance of thermal resistor device Electricity 389 Expired
US5739579A Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections Emerging Cross-Sectional Technologies 296 Expired
US6797979B2 Metal structure for a phase-change memory device Emerging Cross-Sectional Technologies 215 Expired
US6861267B2 Reducing shunts in memories with phase-change material Electricity 207 Expired
US6545287B2 Using selective deposition to form phase-change memory cells Emerging Cross-Sectional Technologies 200 Expired
US6569705B2 Metal structure for a phase-change memory device Emerging Cross-Sectional Technologies 189 Expired
US5817572A Method for forming multileves interconnections for semiconductor fabrication Emerging Cross-Sectional Technologies 152 Expired
US6309956A Fabricating low K dielectric interconnect systems by using dummy structures to enhance process Emerging Cross-Sectional Technologies 88 Expired
US6143647A Silicon-rich block copolymers to achieve unbalanced vias Emerging Cross-Sectional Technologies 67 Expired
US5886410A Interconnect structure with hard mask and low dielectric constant materials Electricity 66 Expired
US5935868A Interconnect structure and method to achieve unlanded vias for low dielectric constant materials Electricity 54 Expired
US6848177B2 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme Emerging Cross-Sectional Technologies 50 Expired
US6051869A Silicon-rich block copolymers to achieve unbalanced vias Emerging Cross-Sectional Technologies 46 Expired
US6303464A Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer Electricity 45 Expired
US6027995A Method for fabricating an interconnect structure with hard mask and low dielectric constant materials Electricity 39 Expired
US6037249A Method for forming air gaps for advanced interconnect systems Electricity 29 Expired
US6040628A Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics Electricity 24 Expired
US6277765A Low-K Dielectric layer and method of making same Electricity 23 Expired
US5880030A Unlanded via structure and method for making same Emerging Cross-Sectional Technologies 18 Expired
US7183567B2 Using selective deposition to form phase-change memory cells Emerging Cross-Sectional Technologies 12 Expired
US6239019A Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics Electricity 12 Expired
US7214632B2 Using selective deposition to form phase-change memory cells Emerging Cross-Sectional Technologies 10 Expired
US6777320B1 In-plane on-chip decoupling capacitors and method for making same Electricity 9 Expired
US7217945B2 Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained thereby Physics 8 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.