Dae-Gyu Park
92Patents
16h-index
126Co-inventors
87Inventor score
Filing activity: Aug 25, 1997 → Jun 2, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8043920B2 | finFETS and methods of making same | Electricity | 82 | Active |
| US6664160B2 | Gate structure with high K dielectric | Electricity | 59 | Expired |
| US6506676B2 | Method of manufacturing semiconductor devices with titanium aluminum nitride work function | Electricity | 56 | Expired |
| US7279413B2 | High-temperature stable gate structure with metallic electrode | Electricity | 46 | Expired |
| US6579767B2 | Method for forming aluminum oxide as a gate dielectric | Electricity | 30 | Expired |
| US7084024B2 | Gate electrode forming methods using conductive hard mask | Electricity | 28 | Expired |
| US8586441B1 | Germanium lateral bipolar junction transistor | Electricity | 27 | Active |
| US7872303B2 | FinFET with longitudinal stress in a channel | Electricity | 26 | Active |
| US8557670B1 | SOI lateral bipolar junction transistor having a wide band gap emitter contact | Electricity | 21 | Active |
| US7989298B1 | Transistor having V-shaped embedded stressor | Electricity | 20 | Active |
| US7439128B2 | Method of creating deep trench capacitor using a P+ metal electrode | Electricity | 20 | Active |
| US7863126B2 | Fabrication of a CMOS structure with a high-k dielectric layer oxidizing an aluminum layer in PFET region | Electricity | 20 | Active |
| US7867839B2 | Method to reduce threshold voltage (Vt) in silicon germanium (SiGe), high-k dielectric-metal gate, p-type metal oxide semiconductor field effect transistors | Electricity | 19 | Active |
| US9059016B1 | Lateral heterojunction bipolar transistors | Electricity | 19 | Active |
| US7504700B2 | Method of forming an ultra-thin [[HfSiO]] metal silicate film for high performance CMOS applications and semiconductor structure formed in said method | Electricity | 18 | Expired |
| US7023064B2 | Temperature stable metal nitride gate electrode | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6391727B1 | Method of manufacturing a semiconductor device utilizing a(Al2O3)X-(TiO2)1-X gate dielectric film | Electricity | 15 | Expired |
| US6524918B2 | Method for manufacturing a gate structure incorporating therein aluminum oxide as a gate dielectric | Electricity | 14 | Expired |
| US8558282B1 | Germanium lateral bipolar junction transistor | Electricity | 14 | Active |
| US9034748B2 | Process variability tolerant hard mask for replacement metal gate finFET devices | Emerging Cross-Sectional Technologies | 12 | Active |
| US6642132B2 | Cmos of semiconductor device and method for manufacturing the same | Electricity | 11 | Expired |
| US6768179B2 | CMOS of semiconductor device and method for manufacturing the same | Electricity | 10 | Expired |
| US6909137B2 | Method of creating deep trench capacitor using a P+ metal electrode | Electricity | 9 | Expired |
| US7157359B2 | Method of forming a metal gate in a semiconductor device using atomic layer deposition process | Electricity | 9 | Expired |
| US6828185B2 | CMOS of semiconductor device and method for manufacturing the same | Electricity | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.