Francis Benistant
30Patents
6h-index
42Co-inventors
69Inventor score
Filing activity: Apr 8, 1998 → Feb 6, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8053340B2 | Method for fabricating semiconductor devices with reduced junction diffusion | Electricity | 97 | Active |
| US9871132B1 | Extended drain metal-oxide-semiconductor transistor | Electricity | 24 | Active |
| US6243289A | Dual floating gate programmable read only memory cell structure and method for its fabrication and operation | Physics | 10 | Expired |
| US6492228B2 | Dual floating gate programmable read only memory cell structure and method for its fabrication and operation | Physics | 10 | Expired |
| US9673084B2 | Isolation scheme for high voltage device | Electricity | 8 | Active |
| US9947788B2 | Device with diffusion blocking layer in source/drain region | Electricity | 7 | Active |
| US8994107B2 | Semiconductor devices and methods of forming the semiconductor devices including a retrograde well | Electricity | 5 | Active |
| US6756268B2 | Modified source/drain re-oxidation method and system | Electricity | 4 | Expired |
| US8354321B2 | Method for fabricating semiconductor devices with reduced junction diffusion | Electricity | 4 | Active |
| US9406752B2 | FinFET conformal junction and high EPI surface dopant concentration method and device | Electricity | 3 | Active |
| US7101743B2 | Low cost source drain elevation through poly amorphizing implant technology | Electricity | 3 | Expired |
| US9966433B2 | Multiple-step epitaxial growth S/D regions for NMOS FinFET | Electricity | 2 | Active |
| US8860142B2 | Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction | Electricity | 2 | Active |
| US6649470B2 | Dual floating gate programmable read only memory cell structure and method for its fabrication and operation | Physics | 2 | Expired |
| US9997225B2 | System and method for modular simulation of spin transfer torque magnetic random access memory devices | Physics | 2 | Active |
| US6972236B2 | Semiconductor device layout and channeling implant process | Electricity | 1 | Expired |
| US7202133B2 | Structure and method to form source and drain regions over doped depletion regions | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9577040B2 | FinFET conformal junction and high epi surface dopant concentration method and device | Electricity | 1 | Active |
| US10164099B2 | Device with diffusion blocking layer in source/drain region | Electricity | 1 | Active |
| US6969646B2 | Method of activating polysilicon gate structure dopants after offset spacer deposition | Electricity | 1 | Expired |
| US9269770B2 | Integrated circuit system with double doped drain transistor | Electricity | 0 | Active |
| US8293544B2 | Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction | Electricity | 0 | Active |
| US7888752B2 | Structure and method to form source and drain regions over doped depletion regions | Emerging Cross-Sectional Technologies | 0 | Active |
| US7037860B2 | Modified source/drain re-oxidation method and system | Electricity | 0 | Expired |
| US7271435B2 | Modified source/drain re-oxidation method and system | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.