Guan-Ru Lee
24Patents
4h-index
11Co-inventors
56Inventor score
Filing activity: Mar 13, 2013 → Apr 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9401371B1 | Sacrificial spin-on glass for air gap formation after bl isolation process in single gate vertical channel 3D NAND flash | Electricity | 44 | Active |
| US9721964B2 | Low dielectric constant insulating material in 3D memory | Electricity | 5 | Active |
| US9184096B2 | Semiconductor structure and manufacturing method for the same | Electricity | 4 | Active |
| US9019768B1 | Split page 3D memory array | Physics | 4 | Active |
| US9673051B1 | High density patterned material on integrated circuits | Electricity | 4 | Active |
| US9583503B1 | Three-dimensional semiconductor device and method of manufacturing the same | Electricity | 3 | Active |
| US11678486B2 | 3D flash memory with annular channel structure and array layout thereof | Electricity | 2 | Active |
| US9023701B1 | Three-dimensional memory and method of forming the same | Electricity | 2 | Active |
| US11476276B2 | Semiconductor device and method for fabricating the same | Electricity | 1 | Active |
| US9293348B2 | Semiconductor structure including stacked structure and method for forming the same | Electricity | 1 | Active |
| US9754790B2 | Memory device and method for fabricating the same | Electricity | 1 | Active |
| US11778823B2 | Three-dimensional memory device and method for manufacturing the same | Electricity | 1 | Active |
| US12022654B2 | Memory device and method of manufacturing the same | Electricity | 0 | Active |
| US12245428B2 | 3D AND flash memory device and method of fabricating the same | Electricity | 0 | Active |
| US11985822B2 | Memory device | Electricity | 0 | Active |
| US11195847B2 | Memory device and method for forming the same | Electricity | 0 | Active |
| US12310023B2 | 3D semiconductor device and array layout with isolated conductive pillars | Electricity | 0 | Active |
| US10312256B1 | Method of manufacturing three-dimensional stacked semiconductor structure and structure manufactured by the same | Electricity | 0 | Active |
| US9142454B1 | Semiconductor structure and method for manufacturing the same | Electricity | 0 | Active |
| US12200935B2 | 3D and flash memory device and method of fabricating the same | Electricity | 0 | Active |
| US11638379B2 | Method for forming memory device | Electricity | 0 | Active |
| US9171862B2 | Three-dimensional memory and method of forming the same | Electricity | 0 | Active |
| US9190467B2 | Semiconductor structure and manufacturing method of the same | Electricity | 0 | Active |
| US9425202B2 | Split page 3D memory array | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.