Larry Nesbit
41Patents
14h-index
32Co-inventors
81Inventor score
Filing activity: Sep 21, 1981 → Feb 14, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6713835B1 | Method for manufacturing a multi-level interconnect structure | Electricity | 246 | Expired |
| US6429068B1 | Structure and method of fabricating embedded vertical DRAM arrays with silicided bitline and polysilicon interconnect | Electricity | 38 | Expired |
| US6573137B1 | Single sided buried strap | Electricity | 31 | Expired |
| US7374793B2 | Methods and structures for promoting stable synthesis of carbon nanotubes | Emerging Cross-Sectional Technologies | 28 | Active |
| US7585614B2 | Sub-lithographic imaging techniques and processes | Electricity | 24 | Active |
| US6184107A | Capacitor trench-top dielectric for self-aligned device isolation | Electricity | 24 | Expired |
| US6509624B1 | Semiconductor fuses and antifuses in vertical DRAMS | Electricity | 23 | Expired |
| US7038299B2 | Selective synthesis of semiconducting carbon nanotubes | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6084276A | Threshold voltage tailoring of corner of MOSFET device | Electricity | 22 | Expired |
| US4398341A | Method of fabricating a highly conductive structure | Emerging Cross-Sectional Technologies | 20 | Expired |
| US7691720B2 | Vertical nanotube semiconductor device structures and methods of forming the same | Emerging Cross-Sectional Technologies | 17 | Active |
| US6727539B2 | Embedded vertical DRAM arrays with silicided bitline and polysilicon interconnect | Electricity | 17 | Expired |
| US6309924A | Method of forming self-limiting polysilicon LOCOS for DRAM cell | Electricity | 15 | Expired |
| US6541810B2 | Modified vertical MOSFET and methods of formation thereof | Electricity | 15 | Expired |
| US6890828B2 | Method for supporting a bond pad in a multilevel interconnect structure and support structure formed thereby | Electricity | 14 | Expired |
| US6989308B2 | Method of forming FinFET gates without long etches | Electricity | 12 | Expired |
| US5994202A | Threshold voltage tailoring of the corner of a MOSFET device | Electricity | 11 | Expired |
| US5923991A | Methods to prevent divot formation in shallow trench isolation areas | Electricity | 10 | Expired |
| US7211844B2 | Vertical field effect transistors incorporating semiconducting nanotubes grown in a spacer-defined passage | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6620676B2 | Structure and methods for process integration in vertical DRAM cell fabrication | Electricity | 7 | Expired |
| US7273794B2 | Shallow trench isolation fill by liquid phase deposition of SiO2 | Electricity | 7 | Expired |
| US7829883B2 | Vertical carbon nanotube field effect transistors and arrays | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6998204B2 | Alternating phase mask built by additive film deposition | Physics | 6 | Expired |
| US7250347B2 | Double-gate FETs (Field Effect Transistors) | Electricity | 6 | Expired |
| US6790739B2 | Structure and methods for process integration in vertical DRAM cell fabrication | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.