Paul Gutwin
23Patents
5h-index
28Co-inventors
69Inventor score
Filing activity: Aug 30, 1991 → Dec 5, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6532520B1 | Method and apparatus for allocating data and instructions within a shared cache | Physics | 34 | Expired |
| US5239481A | Method for measuring pulse distortion | Physics | 18 | Expired |
| US5796621A | Circuit delay abstraction tool | Physics | 12 | Expired |
| US6178467A | Microprocessor system requests burstable access to noncacheable memory areas and transfers noncacheable address on a bus at burst mode | Physics | 9 | Expired |
| US6829755B2 | Variable detail automatic invocation of transistor level timing for application specific integrated circuit static timing analysis | Physics | 7 | Expired |
| US6449693B1 | Method and apparatus for improving caching within a processor system | Physics | 5 | Expired |
| US6588000B2 | Method of partitioning large transistor design to facilitate transistor level timing | Physics | 3 | Expired |
| US11532708B2 | Stacked three-dimensional field-effect transistors | Electricity | 1 | Active |
| US11923364B2 | Double cross-couple for two-row flip-flop using CFET | Electricity | 1 | Active |
| US12224281B2 | Interdigitated device stack | Electricity | 0 | Active |
| US11830852B2 | Multi-tier backside power delivery network for dense gate-on-gate 3D logic | Electricity | 0 | Active |
| US12218135B2 | Wiring in diffusion breaks in an integrated circuit | Electricity | 0 | Active |
| US12176293B2 | Inter-tier power delivery network (PDN) for dense gate-on-gate 3D logic integration | Electricity | 0 | Active |
| US11961802B2 | Power-tap pass-through to connect a buried power rail to front-side power distribution network | Electricity | 0 | Active |
| US11764113B2 | Method of 3D logic fabrication to sequentially decrease processing temperature and maintain material thermal thresholds | Electricity | 0 | Active |
| US12336274B2 | Self-aligned method for vertical recess for 3D device integration | Electricity | 0 | Active |
| US12051638B2 | Integrated high efficiency transistor cooling | Emerging Cross-Sectional Technologies | 0 | Active |
| US12002862B2 | Inter-level handshake for dense 3D logic integration | Performing Operations; Transporting | 0 | Active |
| US12414367B2 | Tapered device for lateral gate all around devices | Electricity | 0 | Active |
| US6671218B2 | System and method for hiding refresh cycles in a dynamic type content addressable memory | Physics | 0 | Expired |
| US11764266B2 | Three-dimensional semiconductor device | Electricity | 0 | Active |
| US11581242B2 | Integrated high efficiency gate on gate cooling | Electricity | 0 | Active |
| US11723187B2 | Three-dimensional memory cell structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.