Wenbing Yang
27Patents
11h-index
47Co-inventors
75Inventor score
Filing activity: Mar 20, 2003 → Feb 7, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9576811B2 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Electricity | 59 | Active |
| US9806252B2 | Dry plasma etch method to pattern MRAM stack | Electricity | 54 | Active |
| US9257638B2 | Method to etch non-volatile metal materials | Electricity | 51 | Active |
| US9805941B2 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Electricity | 41 | Active |
| US9130158B1 | Method to etch non-volatile metal materials | Electricity | 34 | Active |
| US10056264B2 | Atomic layer etching of GaN and other III-V materials | Electricity | 20 | Active |
| US10096487B2 | Atomic layer etching of tungsten and other metals | Emerging Cross-Sectional Technologies | 19 | Active |
| US10374144B2 | Dry plasma etch method to pattern MRAM stack | Electricity | 18 | Active |
| US9972504B2 | Atomic layer etching of tungsten for enhanced tungsten deposition fill | Electricity | 18 | Active |
| US7111203B2 | Method for implementing data backup and recovery in computer hard disk | Physics | 16 | Expired |
| US10186426B2 | Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch) | Electricity | 14 | Active |
| US10763083B2 | High energy atomic layer etching | Electricity | 11 | Active |
| US7447888B2 | Method for restoring computer operating system | Physics | 6 | Expired |
| US10515816B2 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Electricity | 6 | Active |
| US11069535B2 | Atomic layer etch of tungsten for enhanced tungsten deposition fill | Electricity | 5 | Active |
| US10749103B2 | Dry plasma etch method to pattern MRAM stack | Electricity | 5 | Active |
| US10727073B2 | Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces | Electricity | 4 | Active |
| US12105422B2 | Photoresist development with halide chemistries | Electricity | 4 | Active |
| US9391267B2 | Method to etch non-volatile metal materials | Electricity | 2 | Active |
| US11935758B2 | Atomic layer etching for subtractive metal etch | Electricity | 1 | Active |
| US11450513B2 | Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials | Electricity | 1 | Active |
| US9502600B2 | Inorganic solution and solution process for electronic and electro-optic devices | Emerging Cross-Sectional Technologies | 0 | Active |
| US12256645B2 | Chemical etch nonvolatile materials for MRAM patterning | Electricity | 0 | Active |
| US12266542B2 | Atomic layer etching for subtractive metal etch | Electricity | 0 | Active |
| US12080562B2 | Atomic layer etch and ion beam etch patterning | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.